AEROSPACE TECHDAYS 2016 – 7-8 April 2016 – Lyon France

DIPLAT Sum up after 3 years of research.

Ultrafast meets ultrahard Pulsed laser ablation technologies for ultrahard tooling DIPLAT: Enabling Advanced Functionalities of Diamond and Other Ultra-hard Materials by Integrated Pulsed Laser Ablation Technologies

  • Research project financed by the EU,
  • 8 partners from 6 countries including 2 university ETHZ Zurich switzerland, UNOTT Nottingham UK
  • 42 months: Jan. 13 – Jul. 16
  • Goal: Develop laser processes and technology for ultra-hard materials in tooling applications with a target of :
    • Faster processing
    • Less subsurface damaging of PCD
    • Innovative and complex tool geometries possible
  • Structured around three main application domains
    • abrasive surfaces for materialographic analyses
    • grinding and dressing tools for the gear grinding industry
    • milling and drilling tools for challenging application

presentation made by Jean-Francois Bucourt, Diamoutils SAS and Josquin Pfaff, ETH Zurich.